JL 2.4G Bluetooth Low-Latency Audio Headset Solution: Chip Selection, Latency, Hardware Design



This document introduces JL’s low-latency audio headset solution using 2.4G/Bluetooth technology. For chip selection, the USB dongle side uses JL7016M or JL7086E, capable of 48KHz/16bit stereo output and supports UAC (USB Audio Class), meaning no driver installation is required. On the headset side, JL7083G is used for TWS, and JL7083F for stereo headphones.

The audio transmission and decoding process includes:

  • Uplink (microphone to host): Audio is sampled via USB (~2.5ms), encoded (~1ms), and transmitted over 2.4G/Bluetooth using LC3 codec at 48KHz/16bit mono.
  • Downlink (host to headset): Audio is LC3 encoded at 48KHz/16bit stereo, transmitted wirelessly to the headset, decoded (~2ms), then played back via DAC (~7ms).

The overall latency:

  • Around 20ms for TWS headphones
  • Around 17ms for over-ear/headband-style headphones These values are considered excellent for gaming and multimedia scenarios where low latency is crucial.

1. JL 2.4G Bluetooth Low-Latency Headset Solution Overview

(1) Chipset & Basic Capabilities:

  • JL7016M or JL7086E for USB Dongle (receiver/transmitter)
  • Outputs 48KHz/16bit stereo
  • Supports UAC (plug-and-play with no driver required)

(2) Encoding - Transmission - Decoding Flow:

  • Uplink (mic to host device):
  • Downlink (host to headset):

(3) Latency Performance:

  • TWS headphones total latency: ~20ms
  • Over-ear headphones total latency: ~17ms
  • Excellent for low-latency needs in gaming/video applications

2. Chip Solution Comparison

  • Headband-style gaming headset: JL7086E + JL7083F
  • TWS-style earbuds: JL7086E + JL7083G

Note on Power Consumption: 2.4G wireless inherently consumes more power. The typical power consumption is around 20-30mA, and currently, this is a design limitation that cannot be significantly reduced.

3. High-Level Hardware Block Diagram (Dongle Side)

Diagram omitted here — typically includes USB interface, JL7016M/7086E chip, 2.4G RF module, and antenna

4. High-Level Hardware Block Diagram (Headset Side)

Diagram omitted here — typically includes microphone, JL7083F/G chip, speaker/DAC output, battery/power management, and antenna

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