BLE Voice

This document introduces JL’s low-latency audio headset solution using 2.4G/Bluetooth technology. For chip selection, the USB dongle side uses JL7016M or JL7086E , capable of 48KHz/16bit stereo output and supports UAC (USB Audio Class), meaning no driver installation is required. On the headset side, JL7083G is used for TWS, and JL7083F for stereo headphones. The audio transmission and decoding process includes: Uplink (microphone to host): Audio is sampled via USB (~2.5ms), encoded (~1ms), and transmitted over 2.4G/Bluetooth using LC3 codec at 48KHz/16bit mono. Downlink (host to headset): Audio is LC3 encoded at 48KHz/16bit stereo, transmitted wirelessly to the headset, decoded (~2ms), then played back via DAC (~7ms). The overall latency : Around 20ms for TWS headphones Around 17ms for over-ear/headband-style headphones These values are considered excellent for gaming and multimedia scenarios where low latency is crucial. 1. JL 2.4G Bluetooth Low-Latency Headset Soluti...

  📈 1. Market Scale and Growth Global Shipments Global Bluetooth device shipments are projected to reach 7.5 billion units in 2025, marking 13% YoY growth , primarily driven by IoT and smart wearable demand. China Market Performance China's Bluetooth Low Energy (BLE) chip market size reached ¥46.288 billion , with over 20% annual growth . Smart home applications contribute >50% of demand. 🏆 2. Competitive Landscape & Key Players Mobile Chip Sector Top 2 Bluetooth Audio Chip Vendors Apple : Captures 14% of premium TWS market with proprietary chips; leads in profitability but ranks third in volume. JL/JieLi Technology : #1 in shipments (27% share), dominates cost-performance segment. BLE IC Leaders Nordic , TI , Dialog collectively hold 60% global share , leading in medical/industrial IoT. ⚙️ 3. Tech Innovation & Trends 1. Protocol Upgrades Bluetooth 6.0 : Boosting transmission efficiency by 40% . LE Audio : Enables multi-device sync; latency reduced to ...